M5STACK StackChan AI Desktop Robot User Manual

Stack Chan
2026

I-OUTLINE

StackChan is ESP32 board which based on ESP32-S3 chip, contained 2-inch TFT screen. The board is made of PC+ABC.

1.1 Ukwakhiwa kwe-Hardware
The hardware of CORES3: ESP32-S3 chip, TFT screen, Green LED, Button, GROVE interface, TypeC-to-USB interface, Power Management chip and battery.
ESP32-S3 The ESP32 is a dual-core system with two Harvard Architecture Xtensa LX6 CPUs. All embedded memory,external memory and peripherals are located on the data bus and/or the instruction bus of these CPUs. With some minor exceptions (see below), the address mapping of two CPUs is symmetric, meaning that they use the same addresses to access the same memory. Multiple peripherals in the system can access embeddedmemory via DMA.
I-TFT Screen iyisikrini esingu-2-intshi esinemibala eshayelwa i-ILI9342C nesixazululo esingu-320 x 240.
I-vol esebenzayotagUbubanzi be-e bungu-2.6~3.3V, izinga lokushisa elisebenzayo lingu-25~55°C.
I-Power Management chip yi-X-Powers's AXP2101. Umthamo wokusebenzatagUbubanzi be-e bungu-2.9V~6.3V kanti amandla okushaja angu-1.4A.
StackChan equips ESP32 with everything needed for programming, everything needed for operation and development

I-PIN DESCRIPTION

2.1.I-USB INTERFACE
Uhlobo lwe-M5CAMREA lokucushwa kohlobo C lokusebenzelana kwe-USB, lusekela iphrothokholi yokuxhumana evamile ye-USB2.0.

2.2.GROVE INTERFACE
4p spacing 2.0mm M5CAMREA GROVE Ports. A, Port. B, and Port. C, the internal cables are connected to GND, 5V, GPIO1, GPIO2, GPIO8, GPIO9, GPIO17, and GPIO18.

INCAZELO YOMSEBENZI

Lesi sahluko sichaza amamojula nemisebenzi ehlukahlukene ye-ESP32-S3.
3.1.CPU NEMEMORY
I-Xtensa® dual-core 32-bit LX7 microprocessor, efika ku-240 MHz

• 384 KB ROM
• 512 KB SRAM
• 16 KB SRAM ku-RTC
• I-SPI, i-Dual SPI, i-Quad SPI, i-Octal SPI, i-QPI ne-OPI interface evumela ukuxhumeka ku-flash eminingi kanye ne-RAM yangaphandle
• Isilawuli se-flash esinenqolobane siyasekelwa
• I-Flash in-Circuit Programming (ICP) iyasekelwa

3.2.INCAZELO YESITORESHI
3.2.1. I-Flash yangaphandle kanye ne-SRAM
I-ESP32-S3 isekela i-SPI, i-Dual SPI, i-Quad SPI, i-Octal SPI, i-QPI ne-OPI interfaces evumela ukuxhumeka ku-flash yangaphandle eminingi kanye ne-RAM.
The external flash and RAM can be mapped into the CPU instruction memory space and read-only data memory space. The external RAM can also be mapped into the
CPU data memory space. ESP32-S3 supports up to 1GB of external flash and RAM, and hardware encryption/decryption based on XTS-AES to protect users’programs and data in flash and external RAM.
Ngokusebenzisa ama-caches anesivinini esikhulu, i-ESP32-S3 ingasekela ngesikhathi kufika:

• External flash or RAMmapped into 32 MB instruction space as individual blocks of 64 KB
• I-RAM yangaphandle ifakwe kumephu yesikhala sedatha esingu-32 MB njengamabhulokhi angawodwana angu-64 KB. I-8-bit, 16-bit, 32-bit, kanye ne-128-bit yokufunda nokubhala kuyasekelwa. I-flash yangaphandle ingaphinda ifakwe kumephu yesikhala sedatha esingu-32 MB njengamabhulokhi angawodwana angu-64 KB, kodwa asekela kuphela ukufundwa kwe-8-bit, 16-bit, 32-bit kanye no-128-bit.

3.3.IWASHI LE-CPU
Iwashi le-CPU linemithombo emithathu engaba khona:

• Iwashi lekristalu elikhulu langaphandle
• I-oscillator ye-RC esheshayo yangaphakathi (imvamisa icishe ibe ngu-17.5 MHz, futhi iyalungiseka)
• Iwashi le-PLL

Uhlelo lokusebenza lungakhetha umthombo wewashi emawashini amathathu angenhla.
The selected clock source drives the
CPU clock directly, or after division, depending on the application. Once the CPU is reset, the default clock source would be the external main crystal clock divided by 2.
3.4.RTC AND LOWPOWER MANAGEMENT
Ngokusetshenziswa kobuchwepheshe bokuphatha amandla obuthuthukisiwe, i-ESP32-S3 ingashintsha phakathi kwezindlela zamandla ezihlukene. (bheka ithebula1).

• Imodi esebenzayo: I-CPU nerediyo ye-chip ivuliwe. I-chip ingathola, idlulise, noma ilalele.
• Imodi yokulala ye-Modems: I-CPU iyasebenza futhi isivinini sewashi singancishiswa. I-baseband engenantambo nomsakazo kuvaliwe, kodwa ukuxhumana okungenantambo kungahlala kusebenza.
• Lightsleep mode: The CPU is paused. The RTC peripherals, as well as the ULP coprocessor can be woken up periodically by the timer.
  Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake up the chip. Wireless connection can remain active. Users can optionally decide what peripherals to shut down/keep on (refer to Figure 1), for power-saving purpose.
• Imodi yokulala okujulile: I-CPU kanye nama-peripherals amaningi anikwa amandla.
  Only the RTC memory is powered on and RTC peripherals are optional. Wi-Fi connection data are stored in the RTC memory. The
  I-ULP coprocessor iyasebenza.

Current Consumption in Low Power Modes: TABLE 1

ELECTRICALCHARACTERISTICS

4.1.ABSOLUTEMAXIMUMRATINGS
Table2:AbsoluteMaximumRatings

1. I-VIO kuphedi yokuphakela amandla, Bheka i-ESP32 I-Technical Specification Appendix IO_MUX, njenge-SD_CLK yokunikezwa kwamandla kwe-VDD_SDIO.
4.2.WIFI RADIO AND BASEBAND
Umsakazo we-Wi-Fi we-ESP32-S3 kanye ne-baseband isekela izici ezilandelayo:

• 802.11b/g/n
• 802.11n MCS0-7 esekela umkhawulokudonsa ongu-20 MHz no-40 MHz
• 802.11n MCS32
• 802.11n 0.4 μs isikhawu sokuqapha
• Izinga ledatha lifika ku-150 Mbps
• I-RX STBC (ukusakazwa kwendawo okukodwa)
• Amandla okudlulisa alungisekayo
• Ukuhlukahluka kwe-antenna:

I-ESP32-S3 isekela ukuhlukahluka kwezinti ngeswishi ye-RF yangaphandle. Le swishi ilawulwa eyodwa noma ngaphezulu
Ama-GPIO, futhi asetshenziselwa ukukhetha i-antenna engcono kakhulu yokunciphisa imiphumela yokungapheleli kwesiteshi.
4.3. IMICIMBI YE-BLUETOOTH LE RF TRANSMITTER (TX).
Ithebula 3: Izimpawu Zokudlulisa I-Bluetooth LE 1 Mbps

4.4. IMINININGWANE YE-BLUETOOTH LE RF RECEIVER (RX).
Ithebula 4: Izimpawu Zomamukeli I-Bluetooth LE 1 Mbps

Isexwayiso se-FCC

Isexwayiso se-FCC:
Noma yiziphi Izinguquko noma ukuguqulwa okungagunyazwanga ngokucacile yinhlangano enesibopho sokuthobela imithetho kungasusa igunya lomsebenzisi lokusebenzisa okokusebenza. Le divayisi ithobela ingxenye 15 yemithetho ye-FCC. Ukusebenza kungaphansi kwezimo ezimbili ezilandelayo: (1) Lolu cingo angeke lubangele ukuphazamiseka okuyingozi, futhi (2) lolu cingo kufanele lwamukele noma yikuphi ukuphazamiseka okutholiwe, okuhlanganisa ukuphazamiseka okungase kubangele ukusebenza okungafuneki.
ISAZISO ESIBALULEKILE:
Qaphela: Lesi sisetshenziswa sihloliwe futhi satholwa ukuthi sithobela imikhawulo yedivayisi yedijithali Yekilasi B, ngokuvumelana nengxenye 15 Yemithetho ye-FCC. Le mikhawulo iklanyelwe ukuhlinzeka ngokuvikeleka okufanele ekuphazanyisweni okuyingozi ekufakweni kwendawo yokuhlala.
This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does -cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
— Hlehlisa noma hambisa uthi olwamukelayo.
- Khulisa ukuhlukana phakathi kwemishini nomamukeli.
— Xhuma okokusebenza endaweni yokuphuma kusekhethi ehlukile kuleyo lapho umamukeli axhumeke khona.
— Xhumana nomthengisi noma uchwepheshe werediyo/TV onolwazi ukuze uthole usizo.
Isitatimende Sokuvezwa Kwemisebe ye-FCC: Le mishini ihambisana nemikhawulo yokuvezwa kwemisebe ye-FCC ebekelwe imvelo engalawulwa.