Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Imanuwali Yomnikazi Wabanikazi Bama-Microcontrollers

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - ikhasi lokuqala

Isifinyezo

Lo mhlahlandlela uhloselwe ukusiza labo abajwayelene ne-QFP (Quad Flat Package) futhi abahlela ukusebenzisa amaphakheji e-BGA (Ball Grid Array) okokuqala ngqa. Lo mbhalo uyisifinyezo samaphuzu okufanele uwaqaphele lapho uklama ibhodi esebenzisa iphakheji ye-BGA.

Idivayisi eqondiwe
Umndeni wakwa-RA, umndeni wakwa-RX

Isici sokupakishwa kwe-BGA

Kuyini ukupakishwa kwe-BGA

Iphakheji ye-BGA ibhekisela ephaketheni lapho amabhola e-solder afakwe ngemuva kwephakheji (bheka Umfanekiso 1). I-BGA inezici ezilandelayo uma iqhathaniswa ne-QFP.

Izici zephakheji ye-BGA uma kuqhathaniswa ne-QFP:
- Iphakheji ye-BGA ngokuvamile incane kune-LQFP enani elifanayo lamaphini.
- Iphakheji ye-BGA ngokuvamile inamaphinikhodi amaningi kune-LQFP yosayizi wephakheji ofanayo.
- Amaphakheji e-BGA angcono ekuqedeni ukushisa njengoba anokumelana okuphansi kwe-thermal kunamaphakheji e-QFP njengoba kunendlela engcono yokukhipha ukushisa ngokusebenzisa i-substrate.
- Amaphakheji e-BGA angama-impedance aphansi angcono kanye nesivinini sokudlulisela okuphezulu ngoba ubude bephakheji bungafinyezwa nge-miniaturization kanye ne-substrate (interposer) ingaba i-multilayered.
- Amaphakheji e-BGA anohlelo olufanele lwebhola lapho izici zikagesi zicatshangelwa. Kodwa-ke, uma akudingekile ukucabangela izici zikagesi, ibhola lingafakwa noma kuphi.

Qaphela: I-BGA enempahla yephakheji yepulasitiki ibizwa ngokuthi i-PBGA (i-Plastiki BGA). E-Renesas, i-BGA ngokuvamile ibhekisela ku-PBGA.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Cross-section view yephakheji ye-BGA kanye ne-QFP kanye ne-sample exampLes
Umfanekiso 1, Isiphambano view yephakheji ye-BGA kanye ne-QFP kanye ne-sample exampLes

Example yokuhlelwa kwebhola le-BGA

Njengoba kuboniswe kumfanekiso wesi-2, inani lamasiginali angaxhunywa ku-QFP licishe lilungiswe ngokuhlobene nosayizi wephakheji (Bheka Umfanekiso 2, Ikesi le-QFP), amaphakheji e-BGA angahlukaniswa cishe abe ngamalungiselelo amathathu ebhola.

– Esokuqala yilapho ibhola libekwe endaweni engaphandle yephakheji (Bheka Umfanekiso 2, Ikesi BGA①). Isetshenziswa uma inani lamasiginali lilincane kusayizi wephakheji.

- Okwesibili yilapho ibhola elishisayo libekwe ngokuqondile ngaphansi kwe-chip ngaphezu komjikelezo wangaphandle wephakheji (Bheka Umfanekiso 2, Ikesi BGA②). Yamukelwa lapho ukuchithwa kokushisa kudinga ukucatshangelwa.

- Okwesithathu yilapho amabhola ebekwe endaweni yonke yephakheji ngaphandle kwezikhala (Bheka Umfanekiso 2, Ikesi BGA③). Isetshenziswa uma inani lamasignali likhulu. Ngokuvamile, kunzima kakhulu ukuklama amaphakheji namabhodi ngephakheji elinjalo, futhi kokubili iphakheji kanye nebhodi elingafakwa kulo kungabiza.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Example yokubekwa kwebhola le-BGA

Incazelo ye-BGA, i-FBGA ne-LGA

Njengoba kukhonjisiwe kuMfanekiso 3, i-BGA ne-FBGA (I-Fine Pitch Ball Grid Array) inezincazelo ezihlukile ze-terminal pitch. Iphakheji ene-terminal pitch engu-1 mm noma ngaphezulu ibizwa ngokuthi i-BGA, futhi iphakheji ene-terminal pitch engu-0.8 mm noma ngaphansi ibizwa ngokuthi i-FBGA.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Incazelo ye-BGA ne-FBGA
Umfanekiso 3, Incazelo ye-BGA ne-FBGA

Njengoba kukhonjisiwe kuMfanekiso 4, i-BGA ne-LGA (Land Grid Array) ziyahlukahluka ngokuba khona noma ukungabikho kwamatheminali ebhola le-solder. Iphakheji elinamatheminali ebhola le-solder libizwa ngokuthi i-BGA, futhi iphakheji elingenazo amatheminali ebhola le-solder libizwa nge-LGA.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Incazelo ye-BGA ne-LGA
Umfanekiso 4, Incazelo ye-BGA ne-LGA

Igama lephakheji nekhodi (ikhodi ye-JEITA)

Iphakheji yama-ICs ethu inikezwe ngokulinganayo ikhodi yephakheji ye-JEITA ngokuhambisana nezinga le-JEITA elithi “EIAJ ED-7303C”. Isakhiwo sekhodi yephakheji ye-JEITA yethulwa ngezansi.
Ikhodi yephakheji iqukethe izinto ezilandelayo ezingu-6 futhi iboniswa ngezinhlamvu eziphezulu ezingu-30.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - 6 izinto

Ikhodi yezinto ezibonakalayo zephakheji: (1)
  1. Ikhodi yempahla yomzimba yephakheji iboniswa njengohlamvu olulodwa ngokuya ngezigaba kuThebula

Ithebula 1, Ikhodi yempahla yomzimba yephakheji
Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Ikhodi yezinto ezibonakalayo zephakheji

Amakhodi Esici Sephakheji: (2)

Ikhodi yesici sokubukeka kwephakheji iboniswa ngezinhlamvu ezifinyelela kwezingu-3 ngokwesidingo ngokuya ngezigaba zokusebenza kuThebula 2.

Ithebula 2, Amakhodi Esici Sokubukeka Kwephakheji
Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Amakhodi Esici Sephakheji

Ikhodi yegama lephakheji eyisisekelo: (3)

Ikhodi yegama lephakheji eyisisekelo iboniswa ngezinhlamvu ezintathu ngokomgomo ngokuya ngegama lephakheji eliyisisekelo. Ukuhlukaniswa kwefomu lephakheji kuvumelana ne-EIAJ ED-7300. Ngaphandle kwalokho, amakhodi ephakeji esuselwe kuphela amakhodi TSOP (1), TSOP (2), DTP (1), kanye ne-DTP (2) ahambisana nekhodi yephakheji eyisisekelo ethi SOP ne-DTP aphathwa njengamakhodi ephakheji ayisisekelo, futhi izinhlamvu ezingu-7 noma ezingu-6 zivunyelwe. Ngalesi sikhathi, i-TSOP (1) ne-TSOP (2) ayisebenzisi i-TSOP (I), i-TSOP (II), noma okunye okunjalo. Ngaphezu kwalokho, esimweni se-TSOP (1), TSOP (2), DTP (1), ne-DTP (2), lapho inani eliphakeme lamadijithi ekhodi yephakheji lidlula amadijithi angama-30, inani lamatheminali ephakheji liyashiywa njengoba kuboniswe ku-ex.ample.

Amakhodi Enombolo Yesikhumulo Sephakheji: (4)

Inombolo yamakhodi etheminali kuphakheji iboniswa ngezinhlamvu ezingeqi kwezingu-5. Itheminali igama elivamile lama-electrode anezindlela ezihlukene zokuxhuma zangaphandle, njengomthofu, izikhonkwane, izindawo, amaqhuqhuva, namabhola. Inkomba ye-nuke emaphakathi ivunyelwe ngaphansi kwezikhonkwane eziyi-100, kanye nezinhlamvu ezi-5 ezicacisiwe. Okwesiboneloample, esimweni sephakheji le-28-pin elinama-nukes angu-2 aphakathi, libhalwe njenge-28/26.

Iphakheji Amakhodi Obukhulu: (5)

Njengoba kuboniswe ku-example, ikhodi yobukhulu bephakheji yephakheji iqukethe "ububanzi bomzimba wephakheji (mm)" × "ubude bomzimba wephakheji (mm)" futhi iboniswa ngezinhlamvu eziphezulu ezingu-11. Nokho, uma inombolo yedesimali ithi “x0” noma “00”, “0” kanye “00” ayaziwa.

Amakhodi Wezikhala Zomugqa Wetheminali: (6)

Ikhodi yesikhala yomugqa wetheminali iboniswa ngezinhlamvu ezi-4. Isikhala somugqa wetheminali ngama-intshi (amayintshi) ngamamilimitha (mm) siyindilinga ngokuya nge-ISO R370.

Izakhiwo ze-BGA Packaging

Ukumelana nokushisa (Inani elibonisa ubunzima bokudlulisa izinga lokushisa)

Uma kuqhathaniswa ne-QFP, i-BGA ine-advantage yokumelana nokushisa okuphansi ngoba inyusa indlela yokukhipha ukushisa nge-substrate. Ngamanye amazwi, ama-BGA anezici ezingcono zokulahla ukushisa kune-QFP (Bheka Umfanekiso 5).

Njengoba kuboniswe ku-Figure 5, uma kuqhathaniswa ne-QFP, i-BGA inokumelana nokushisa okuphansi kune-QFP ngoba ngaphezu kwendlela yokushisa ukushisa okuvela engxenyeni eholayo kanye ne-resin ekhonjiswe umcibisholo obomvu, ukushisa okukhiqizwa yi-chip ekhonjiswe umcibisholo onsomi kukhishwa ngokuqondile ngaphansi kwe-chip kusuka emthonjeni wokukhiqiza ukushisa ngokusebenzisa i-vias namabhola ephakheji.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - indlela yokukhipha ukushisa ye-BGA

Izici zikagesi

Amaphakheji e-BGA angenziwa abe mancane kunamaphakheji anezikhonkwane ezifana namaphakheji e-QFP, angcono ku-impedance ephansi kanye nesivinini esikhulu sokudlulisela (Bheka Umfanekiso 6).

- Uma kuqhathaniswa namaphakheji we-QFP, i-BGA ingafinyeza ubude obuphelele ngaphakathi kwephakheji, ukuze izingxenye ze-inductance nezokumelana zehliswe.

- Ubude bentambo yokubopha kanye nobude bokulandelela ngaphakathi kwephakeji ye-BGA bungafushaniswa ngokuqhubekayo, futhi izingxenye ze-inductance nezokumelana zingehliswa ngokunciphisa usayizi wephakheji we-BGA.

Example: Njengoba i-BGA inganciphisa ukuvinjelwa kokunikezwa kwamandla, kungenzeka ukunciphisa inani lama-bypass capacitor (ngemuva kwalokhu okubizwa ngokuthi i-CC: Chip Capacitor) ekunikezeni amandla futhi kube negalelo ekwehlisweni kwezindleko ze-BOM.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Isithombe sephakheji ye-BGA ubude obuphelele nezici zikagesi
Umfanekiso wesi-6, Isithombe sephakheji le-BGA ubude obuphelele (uma kuqhathaniswa ne-QFP) nezici zikagesi

Ukuqaliswa kokupakishwa kwe-BGA

Uhlu lwe-RA/RX BGA lwama-microcontrollers

Ama-microcontrollers e-RA/RX anikezela ngamaphakheji alandelayo ikakhulukazi kumadivayisi amancane abathengi (Bheka Umfanekiso 7 kanye neThebula 3).

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - i-RA noma i-RX BGA uhlu lwama-microcontrollers
Umfanekiso 7, RA/RX BGA uhlu lwama-microcontrollers

Ithebula 3, Uhlu lwe-BGA yokuhlela ama-microcontrollers e-RA/RX
Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Uhlu lohlu lwe-BGA lwe-RA noma i-RX microcontrollers

Imithetho enconyiwe yokuklama ibhodi ene- through hole (TH)

Imithetho enconyiwe yokuklama ibhodi yamabhodi asebenzisa i-TH ikhonjisiwe ngezansi (Bheka Umfanekiso 8). Ukuze kwandiswe izinzuzo zamaphakheji e-BGA ngokulandela umkhondo nezici, kunconywa ukusebenzisa imithetho yokuklama ibhodi evumela ukuthi umkhondo udlule phakathi kwamabhola. Kunconywa ukuthi ububanzi bokulandelela endaweni yokufaka iphakheji okungenani bube ngu-100 um.

Qaphela: Imithetho enconyiwe ingahluka kuye ngomkhiqizi webhodi, futhi kuyadingeka ukuthintana nomkhiqizi webhodi ukuze uthole imininingwane.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Imithetho yebhodi enconyiwe enembobo
Umfanekiso 8, Imithetho yokwakhiwa kwebhodi enconyiwe enembobo

Ukucushwa kwesendlalelo okunconyiwe

Ngokuqondene nokucushwa kwesendlalelo sebhodi, kunconywa ibhodi le-4-layer (Bheka Umfanekiso 9). Kunconywa ukuthi isilawuli esincane se-RA/RA kufanele sibekwe Kusendlalelo 1 kanye ne-trace yesiginali, i-VSS, nezinye izingxenye, izindiza ze-VSS kufanele zihanjiswe kungqimba 2, indiza encane edingekayo yokuphakela amandla kanye nendiza ye-VSS kufanele kuhanjiswe ku-Layer 3, kanye nezingxenye, ukulandelelwa kwesignali, kanye ne-VSS ku-Layer 4. Uma kudingekile ukuthuthukisa ungqimba lukagesi olungeziwe, kufanele kuthuthukiswe ungqimba lukagesi olungeziwe. 2.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Ukumiswa kwesendlalelo okunconyiwe kwebhodi lezendlalelo ezi-4

Umqondo wokuklama ibhodi eliyisisekelo

Umqondo oyisisekelo wokuklama ibhodi ungahlukaniswa ngezinyathelo ezimbili. Isinyathelo sokuqala (①) lapho isiyingi sangaphandle Umugqa ongu-1 sinentambo enesendlalelo esingaphezulu (Isendlalelo 2) lapho i-RA/RX ifakwe khona , kanye nesinyathelo sesibili (②) lapho indilinga engaphakathi engu-1 Umugqa unentambo ohlangothini olungemuva (Isendlalelo 2) noma isendlalelo esingaphakathi (2 noma RATH/R) lapho ungqimba oluphambene no-4.

Umfanekiso 10 uyi-example yesakhiwo somqondo oyisisekelo Wesendlalelo 1 kanye Nesendlalelo 4 segridi egcwele engu-64 BGA, futhi Umfanekiso 11 uyisibonelo sesakhiwo.ample yomqondo oyisisekelo Wesendlalelo 1 kanye Nesendlalelo 4 sesiyingi sangaphandle 4 Umugqa-144 BGA. Intambo ebomvu ikhombisa umkhondo we-Layer 1, indilinga emnyama ikhombisa ibhola, futhi ucingo oluluhlaza kanye nendilinga eluhlaza kukhombisa umugqa wokuhola ovela ebholeni kanye no-TH. Lesi exampi-le ikhombisa icala lapho ucingo olulodwa ludlula phakathi kwamabhola. Uma umkhondo ungadluli phakathi kwamabhola, ungqimba lokulandela umkhondo lukhuphuka ngomunye, futhi kuye ngokuthi isimo sokulandelela sezinye izendlalelo, inani lezendlalelo ze-substrate lingaba ngu-6 noma ngaphezulu. Indingilizi enamachashazi ampunga ikhombisa ibhola elidlula ku-Layer 1, futhi indilinga eluhlaza ikhombisa u-TH kanye nomugqa wokubiza osuka ku-TH. Nakuba ingaboniswanga, i-capacitor ibekwe eduze kwe-TH. Ngaphezu kwalokho, isikhundla se-TH kanye nokulandelela ukuhoxiswa kwesikhombisi-ndlela kuyashintsha ngokuya ngokucaciswa kwesekethe efakwe nge-microcomputer.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Example yesakhiwo esiyisisekelo Sesendlalelo 1 kanye Nesendlalelo 4 segridi engu-64 (8×8) ye-BGA egcwele (Phezulu View)
Umfanekiso 10, Eksample yesakhiwo esiyisisekelo Sesendlalelo 1 kanye Nesendlalelo 4 segridi engu-64 (8×8) ye-BGA egcwele (Phezulu View)

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - ExampI-le yesakhiwo esiyisisekelo se-L1 kanye ne-L 4 kwangu-144(13×13)BGA i-perimeter yangaphandle imigqa emi-4 (Phezulu View)
Umfanekiso 11, EksampI-le yesakhiwo esiyisisekelo se-L1 kanye ne-L 4 kwangu-144(13×13)BGA i-perimeter yangaphandle imigqa emi-4 (Phezulu View)

Imithetho enconyiwe yokuklama ibhodi
Ukunikezwa kwamandla, VCL

– Xhuma i-capacitor (i-ceramic capacitor enezici ezinhle zokuvama) ephinikhodi yokunikeza amandla enebanga elifushane kakhulu phakathi kwe-VSS ebhanqiwe. I-capacitor ibekwe eduze kwe-IC / iphakheji futhi ixhunywe endizeni evamile ngemva kwe-capacitor (Bheka Umfanekiso 12). I-current yakhelwe ukugeleza ku-IC/iphakheji, ngama-capacitor, futhi ngokusebenzisa indiza ye-VSS yokuphakelwa kwamandla evamile (Bheka Umfanekiso 13).

-,Kutuswa ukuthi i-capacitor ifakwe ohlangothini olufanayo ne-IC/iphakheji lapho amatheminali okuphakela amandla ehlelwa kumjikelezo wangaphandle ongu-2row, futhi ngakolunye uhlangothi (uhlangothi olungemuva/Isendlalelo sesi-4) ukusuka ku-IC/iphakheji lapho amatheminali okuphakela amandla ehlelwa ku-3row noma kamuva.

- Uma kunezincazelo ezifana nebanga ukusuka ku-IC / iphakheji kuya ku-capacitor (ukumelana/inani le-inductance ye-trace kanye ne-THs), i-capacitor capacitance kanye nendawo yokufaka, indawo yokufaka ubuhlalu be-ferrite, ukuhlanganisa isikhundla nezinye izinto zamandla, njll., landela ukucaciswa ngakunye.

- Ububanzi bokulandelela kanye nenombolo ye-THs ngemva kokudlula ku-capacitor kufanele kucabangele ubukhulu bamanje obungageleza, futhi uhlele umkhondo ngobubanzi kanye ne-TH edlula inombolo edingekayo. Hlukanisa lokhu kulandelela ngangokunokwenzeka kwamanye amabhola okunikezwa kwamandla ukuze unciphise inani lokuhlangana (okuhlanganisa nezendlalelo eziseduze).

- Vikela nge-VSS ngangokunokwenzeka. Uma ukuvikela i-VSS kungenzeki, khulisa isikhala (>2×h (ukujiya phakathi kwezingqimba eziseduze)).

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX i-32-Bit Arm Cortex-M Microcontrollers - idizayini ye-capacitor enconyiwe yokunikezwa kwamandla kanye ne-VCL
Umfanekiso 12, Isithombe sedizayini ye-capacitor enconyiwe yokunikezwa kwamandla kanye ne-VCL (Ungqimba 1 no-4, Phezulu View)

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Isithombe esinconyiwe sedizayini ye-capacitor ye-Power Supply ne-VCL
Umfanekiso 13, isithombe sedizayini ye-capacitor enconyiwe ye-Power Supply ne-VCL

Setha kabusha

– Uma uxhuma ngqo ku-IC yokusetha kabusha, beka i-IC yokusetha kabusha eduze ne-microcontroller ngangokunokwenzeka (Bheka Umfanekiso 14).

- Uma ucindezela umsindo, kunconywa ukuthi ufake isihlungi se-low-pass. (Ukuvikela i-VSS akudingekile uma ufaka isihlungi se-low-pass.) (Bheka Umfanekiso 14)

- Gcina ibanga ukusuka kwamanye amasignali (ikakhulukazi amathrekhi anemisinga emikhulu kanye nezimpawu zesignali yesivinini), futhi uwavikele nge-VSS ebanzi futhi enama-TH amaningi (Bheka Umfanekiso 14).

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Isithombe Esiyidizayini Esinconyiwe Sokusetha Kabusha
Umfanekiso 14, Isithombe Somklamo Esinconyiwe Sokusetha Kabusha (Phezulu View)

Iwashi

– Imikhondo yamatheminali okufakwayo/okukhiphayo kwewashi njenge-EXATL, XTAL, XCIN, XOUT, X1, X2, njll. kufanele ibe mfushane ngangokunokwenzeka, kuhlanganise namasekhethi aseduze.

- Hlukanisa lokhu kweminye imikhondo (ikakhulukazi imikhondo enamaza amakhulu namasignali anesivinini esikhulu) futhi uyivikele nge-VSS.

– Ububanzi bokulandelela isihlangu se-VSS kufanele bube ngu-0.3 mm noma ngaphezulu, futhi ibanga phakathi kokulandela isihlangu se-VSS kanye nokulandela iwashi kufanele kube ngu-0.3 ~ 2 mm.

- Isendlalelo esingezansi kwesifunda se-peripheral se-crystal asivumeli ukulandelwa kwamasignali, izinsiza zamandla, noma amaphethini e-VSS (Bheka Umfanekiso 15).

I-OSC

- Ezingxenyeni zangaphandle (ama-capacitors, ama-resistors, njll.) uma usebenzisa i-quartz crystal, khetha izingxenye ezifanele kakhulu ze-crystal ezosetshenziswa.

– Ukunikezwa kukagesi kuzohambisana nemithetho enconyiwe yokwakhiwa kwebhodi eSigabeni 3.5.1.

– Ukulandelela isignali ye-OSC kunentambo enobubanzi bokulandelela obungu-0.1 mm endaweni ekhwezwayo ye-microcontroller, futhi ukuvikela kwe-VSS kwenziwa kungqimba olufanayo nangaphansi. Akukho lutho kungqimba oluphakathi, kuhlanganise nezinye izimpawu. Ibanga elingu-0.3 mm kufanele ligcinwe phakathi kokulandelelwa kwesignali ye-OSC kusendlalelo esifanayo nokunye ukulandelelwa kwesignali (ikakhulukazi imikhondo enamaza amakhulu namaphethini esiginali yesivinini esikhulu) kanye nezihlangu ze-VSS. (Bheka umfanekiso 15)

– Beka ikristalu eduze ngangokunokwenzeka kumatheminali (ngaphakathi kuka-10 mm). (Bheka umfanekiso 15)

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Isithombe esinconyiwe se-OSC
Umfanekiso 15, Isithombe esinconyiwe somklamo we-OSC

I-USB

– Ukunikezwa kukagesi kuzohambisana nemithetho enconyiwe yokwakhiwa kwebhodi eSigabeni 3.5.1. Kodwa-ke, i-USB VSS ihlukaniswe kwezinye futhi ifushanisiwe ngesikhathi esisodwa.

– I-REF resistor ibekwe eduze kwe-IC/iphakheji, kodwa hhayi ngokuhambisana ne-capacitor.

- I-Trace kuhlanganise ne-RREF resistors ivikelwe nge-USBAVSS yonkana isendlalelo esifanayo nesendlalelo esincikene. Uma ingakwazi ukuvikeleka, akufanele ibe eduze nezinye izimpawu noma ihambisane. Ungaweli kakhulu ngangokunokwenzeka. Isikhala ngaphandle ngangokunokwenzeka.

- Amasignali ahlukene (DP, DM) aklanyelwe nge-impedance ehlukile ye-90 Ω ± 10% futhi anezintambo ngamabili (ubude obufanayo, ukuhambisana, ububanzi obufanayo, inombolo efanayo yokugoba, inombolo efanayo ye-THs). Umehluko olinganiselwe wobude bokulandelela ungaphakathi kuka-2 mm (Bheka uMdwebo 16). Isihlangu nge-USB VSS. Uma kungenakwenzeka ukuyivikela, ungayibeki isikhala kwamanye amasignali (ikakhulukazi amathrekhi anamaza amakhulu noma amaphethini esiginali yesivinini esikhulu) noma uwafanise. Ungaweli kakhulu ngangokunokwenzeka. Izikhala/ama-slits ezendlalelo eziseduze kufanele futhi kugwenywe.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Umdwebo Womklamo Onconyiwe Wezimpawu Ezihlukile
Umfanekiso 16, Umdwebo Womklamo Onconyiwe Wezimpawu Ezihlukile

I-Analog

– Umkhondo wesiginali wetheminali ye-analog uyingqimba efanayo nesiphakeli samandla/i-VSS/ezinye izimpawu (ikakhulukazi imikhondo enamaza amakhulu namaphethini esiginali yesivinini esikhulu) enobubanzi be-Min trace kanye /I-Space out izendlalelo eziseduze, yeka ukufana, kanye nesihlangu esine-analog VSS. Ububanzi bokulandelela isivikelo se-analog VSS kufanele okungenani buphindwe kathathu ububanzi bokulandelela isignali ye-analog, futhi ibanga phakathi kokulandelela isignali ye-analog nesihlangu se-analog VSS kufanele buphindwe kathathu ububanzi bokulandelela noma buphindwe kathathu kwezendlalelo eziseduze (Bheka Umfanekiso 17).

- Uma ufaka isihlungi se-low-pass, landela izicaciso ze-analog okufanele zisetshenziswe.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Isithombe esinconyiwe somklamo Exampi-trace evikelekile
Umfanekiso 17, Isithombe somklamo onconyiwe: Exampi-le of trace evikelekile (Phezulu View)

ExampIsakhiwo sebhodi ezungeze iphakheji ye-BGA

Ngokuhambisana nomqondo oyisisekelo wesakhiwo sebhodi eSigabeni 3.4 kanye nemithetho enconyiwe yokwakheka kwebhodi kuSigaba 3.5, ex.ampingxenye yesikhundla sika-TH kanye nesakhiwo se-Layer 1 kanye nesendlalelo sesi-4 esibuye sicabangele ukubekwa kwezingxenye (akukhonjiswa) kuboniswe kuMfanekiso 18 (isb.ample ye-RA6Mx/64BGA) kanye noMfanekiso 19 (isbampi-RA6Mx/144BGA). Ngokunikezwa kwamandla, kunconywa ukucabangela ukuhlelwa kwe-TH ukuze ibe eduze ne-VSS ukuze inombolo edingekayo yama-capacitor ifakwe Kusendlalelo 4 eduze nebhola. Umbuthano onombala omagenta emfanekisweni uyi-exampi-le yepheya ye-TH yokunikezwa kwamandla kanye ne-VSS.

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Example yesakhiwo Sesendlalelo 1 kanye Nesendlalelo 4 sika-64 (8×8) igridi egcwele ye-BGA (Phezulu View)
Umfanekiso 18, Eksample yesakhiwo Sesendlalelo 1 kanye Nesendlalelo 4 sika-64 (8×8) igridi egcwele ye-BGA (Phezulu View)

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - ExampI-le yesakhiwo Sesendlalelo soku-1 no-4 se-144(13×13) i-BGA ye-perimeter yangaphandle imigqa emi-4 (Phezulu View)
Umfanekiso 19, EksampI-le yesakhiwo Sesendlalelo soku-1 no-4 se-144(13×13) i-BGA ye-perimeter yangaphandle imigqa emi-4 (Phezulu View)

Umlando wokubuyekeza

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers - Umlando wokubukeza

Izinyathelo Ezivamile Zokuqaphela Ekuphatheni Iyunithi Yokucubungula Kakhulu kanye Nemikhiqizo Yeyunithi Yeyunithi Ye-Microcontroller

Amanothi okusetshenziswa alandelayo ayasebenza kuwo wonke amayunithi we-Microprocessing kanye neyunithi yemikhiqizo ye-Microcontroller evela kwa-Renesas. Ukuze uthole amanothi anemininingwane okusetshenziswa emikhiqizweni ehlanganiswe yilo mbhalo, bheka izigaba ezifanele zedokhumenti kanye nanoma yiziphi izibuyekezo zobuchwepheshe ezikhishelwe imikhiqizo.

  1. Ukuqapha ngokumelene ne-Electrostatic Discharge (ESD)
    Inkambu kagesi eqinile, lapho ivezwe kudivayisi ye-CMOS, ingabangela ukucekelwa phansi kwe-oxide yesango futhi igcine ithunaza ukusebenza kwedivayisi. Kufanele kuthathwe izinyathelo zokumisa ukukhiqizwa kukagesi omile ngangokunokwenzeka, futhi kuhlakazwe ngokushesha lapho kwenzeka. Ukulawulwa kwemvelo kumele kube ngokwanele. Lapho somile, kufanele kusetshenziswe i-humidifier. Lokhu kunconywa ukugwema ukusebenzisa ama-insulators angakha kalula ugesi omile. Amadivaysi e-semiconductor kufanele agcinwe futhi ahanjiswe esitsheni esingaguquguquki, isikhwama sokuvikela esimile noma impahla yokuqondisa. Wonke amathuluzi okuhlola nawokulinganisa okuhlanganisa amabhentshi okusebenza kanye nephansi kufanele kubekwe phansi. Umsebenzisi kufanele futhi amiswe phansi kusetshenziswa ibhande lasesihlakaleni. Amadivaysi e-semiconductor akufanele athintwe ngezandla ezingenalutho. Izinyathelo ezifanayo kufanele zithathwe kumabhodi esekethe aphrintiwe anamadivayisi afakwe ku-semiconductor.
  2. Icubungula ngokuvula amandla
    Isimo somkhiqizo asichazwanga ngesikhathi lapho kunikezwa amandla. Izimo zamasekhethi angaphakathi ku-LSI azinqunyelwe futhi izimo zezilungiselelo zerejista namaphinikhodi azichazwanga ngesikhathi lapho kunikezwa amandla. Kumkhiqizo oqediwe lapho isignali yokusetha kabusha isetshenziswa kuphinikhodi yokusetha kabusha yangaphandle, izimo zamaphini aziqinisekiswa kusukela ngesikhathi lapho amandla anikezwa khona kuze kuqedwe inqubo yokusetha kabusha. Ngendlela efanayo, izimo zamaphini kumkhiqizo osethwe kabusha umsebenzi wokusetha kabusha amandla e-chip aziqinisekisiwe kusukela ngesikhathi lapho amandla anikezwa khona kuze kube yilapho amandla efika ezingeni lapho ukusetha kabusha kucacisiwe.
  3. Okokufaka kwesignali ngesikhathi sokucishwa kwamandla
    Ungafaki amasignali noma ugesi wokudonsa we-I/O ngenkathi idivayisi ivaliwe. Umjovo wamanje ophumela ekufakweni kwesignali enjalo noma amandla okudonsa e-I/O angase abangele ukungasebenzi kanye namandla angavamile adlula kudivayisi ngalesi sikhathi angabangela ukuwohloka kwezinto zangaphakathi. Landela umhlahlandlela wesignali yokokufaka ngesikhathi sokucisha amandla njengoba kuchazwe kumadokhumenti womkhiqizo wakho.
  4. Ukuphatha izikhonkwane ezingasetshenzisiwe
    Bamba izikhonkwane ezingasetshenzisiwe ngokuhambisana neziqondiso ezinikezwe ngaphansi kokuphathwa kwezikhonkwane ezingasetshenzisiwe kumanuwali. Izikhonkwane zokufaka zemikhiqizo ye-CMOS zivame ukuba sesimweni sokungasebenzi kahle. Kusebenza ngephinikhodi engasetshenzisiwe esimweni sesekhethi evulekile, umsindo owengeziwe we-electromagnetic ungeniswa eduze kwe-LSI, ukudubula okuhlobene okugeleza kwamanje ngaphakathi, futhi ukungasebenzi kahle kwenzeka ngenxa yokubonwa okungamanga kwesimo sephini njengesignali yokufaka. kwenzeke.
  5. Izimpawu zewashi
    Ngemva kokufaka ukusetha kabusha, khulula kuphela umugqa wokusetha kabusha ngemva kokuba isignali yewashi lokusebenza izinzile. Lapho ushintsha isignali yewashi ngesikhathi sokusebenza kohlelo, linda kuze kube yilapho isignali yewashi eliqondiwe izinzile. Uma isignali yewashi ikhiqizwa nge-resonator yangaphandle noma i-oscillator yangaphandle phakathi nokusetha kabusha, qinisekisa ukuthi umugqa wokusetha kabusha ukhululwa kuphela ngemva kokuzinza okuphelele kwesignali yewashi. Ukwengeza, lapho ushintshela kusignali yewashi ekhiqizwe nge-resonator yangaphandle noma i-oscillator yangaphandle ngenkathi ukwenziwa kohlelo kuqhubeka, linda kuze kube yilapho isignali yewashi eliqondiwe izinzile.
  6. Voltage-application waveform at input pin
    Ukuhlanekezelwa kwe-Waveform ngenxa yomsindo wokufakwayo noma igagasi elibonisiwe kungase kubangele ukungasebenzi kahle. Uma okokufaka kwedivayisi ye-CMOS kuhlala endaweni ephakathi kwe-Vɪɩ (Ubukhulu.) kanye ne-Vɪʜ (Min.) ngenxa yomsindo, ngokwesiboneloampfuthi, idivayisi ingase ingasebenzi kahle. Qaphela ukuvimbela umsindo oxoxayo ukuthi ungangeni kudivayisi lapho ileveli yokufaka isilungisiwe, kanye nasesikhathini soshintsho lapho ileveli yokokufaka idlula endaweni ephakathi kwe-Vɪɩ (Max.) ne-Vɪʜ (Min.).

Qaphela

  1. Izincazelo zamasekhethi, isoftware nolunye ulwazi oluhlobene kulo mbhalo kunikezwa kuphela ukukhombisa ukusebenza kwemikhiqizo ye-semiconductor kanye nesicelo ex.ampLes. Unesibopho esigcwele sokuhlanganiswa nanoma yikuphi okunye ukusetshenziswa kwamasekhethi, isofthiwe, nolwazi ekwakhiweni komkhiqizo noma isistimu yakho. I-Renesas Electronics ilahla noma isiphi isikweletu sanoma ikuphi ukulahlekelwa kanye nomonakalo odalwe nguwe noma izinkampani zangaphandle ezivela ngenxa yokusebenzisa la masekethi, isofthiwe, noma ulwazi.
  2. I-Renesas Electronics ngalokhu iyazichitha ngokusobala noma yiziphi iziqinisekiso ezimelene necala kanye nesibopho sokwephulwa komthetho nanoma yiziphi ezinye izimangalo ezibandakanya amalungelo obunikazi, amalungelo okushicilela, noma amanye amalungelo empahla yengqondo yabantu besithathu, ngokuvela noma ngenxa yokusebenzisa imikhiqizo ye-Renesas Electronics noma ulwazi lobuchwepheshe oluchazwe kulo mbhalo, kuhlanganisa kodwa akukhawulelwe kokuthi, idatha yomkhiqizo, imidwebo, amashadi, izinhlelo, ama-algorithms, kanye nesib sohlelo lokusebenzaampLes.
  3. Ayikho ilayisensi, eshiwo, eshiwo noma ngenye indlela, enikezwa ngaphansi kwanoma yimaphi amalungelo obunikazi, amalungelo okushicilela noma amanye amalungelo empahla yengqondo ye-Renesas Electronics noma amanye.
  4. Uzoba nesibopho sokunquma ukuthi yimaphi amalayisensi adingekayo kunoma yiziphi izinkampani zangaphandle, kanye nokuthola lawo malayisensi okungenisa ngokusemthethweni, ukuthekelisa, ukukhiqiza, ukuthengisa, ukusetshenziswa, ukusatshalaliswa noma okunye ukulahlwa kwanoma imiphi imikhiqizo ehlanganisa imikhiqizo ye-Renesas Electronics, uma kudingeka.
  5. Ngeke uguqule, uguqule, ukopishe, noma uhlehlise noma yimuphi umkhiqizo we-Renesas Electronics, noma ngabe uphelele noma ingxenye yawo. I-Renesas Electronics ilahla noma isiphi isikweletu sanoma yikuphi ukulahlekelwa noma umonakalo owenziwe nguwe noma izinkampani zangaphandle ezivela kulokho kuguqulwa, ukuguqulwa, ukukopishwa noma ukuhlehlisa ubunjiniyela.
  6. Imikhiqizo ye-Renesas Electronics ihlukaniswa ngokwalawa mabanga ekhwalithi amabili alandelayo: “Okujwayelekile” kanye “Nekhwalithi Ephezulu”. Izinhlelo ezihlosiwe zomkhiqizo ngamunye we-Renesas Electronics zincike ezingeni lekhwalithi yomkhiqizo, njengoba kukhonjisiwe ngezansi.
    “Okujwayelekile”: Amakhompyutha; impahla yasehhovisi; izinto zokuxhumana; imishini yokuhlola neyokulinganisa; izinto ezilalelwayo nezibonwayo; izinto zikagesi zasendlini; amathuluzi omshini; izinto zomuntu siqu zikagesi; amarobhothi ezimboni; njll.
    “Ikhwalithi Ephakeme”: Izimpahla zokuthutha (izimoto, izitimela, imikhumbi, njll.); ukulawulwa kwethrafikhi (amalambu omgwaqo); izinto zokuxhumana ezinkulu; amasistimu okugcina ezezimali abalulekile; izinto zokulawula ukuphepha; njll.
    Ngaphandle kwalapho kuqokwe ngokucacile njengomkhiqizo onokwethenjelwa kakhulu noma umkhiqizo wezindawo ezinokhahlo eshidini ledatha le-Renesas Electronics noma omunye umbhalo we-Renesas Electronics, imikhiqizo ye-Renesas Electronics ayihloselwe noma ayigunyaziwe ukuthi isetshenziswe emikhiqizweni noma ezinhlelweni ezingase zibe usongo oluqondile empilweni yomuntu noma ukulimala komzimba (izinto zokwenziwa ezisekela ukuphila okuzenzela noma amasistimu; ukufakelwa kokuhlinzwa; njll.), noma kungase kubangele umonakalo omkhulu wempahla (uhlelo lwasemkhathini; iziphindaphinda ezingaphansi kolwandle; izinhlelo zokulawula amandla enuzi; izinhlelo zokulawula izindiza; izinhlelo zezitshalo ezibalulekile; amathuluzi ezempi; njll.). I-Renesas Electronics ichitha noma yisiphi isikweletu sanoma imuphi umonakalo noma ukulahlekelwa okudalwe nguwe noma ezinye izinkampani ezivela ekusetshenzisweni kwanoma yimuphi umkhiqizo we-Renesas Electronics ongahambisani nanoma yiliphi ishidi ledatha le-Renesas Electronics, imanuwali yomsebenzisi noma omunye umbhalo we-Renesas Electronics.
  7. Awukho umkhiqizo we-semiconductor ovikeleke ngokuphelele. Naphezu kwanoma yiziphi izinyathelo zokuphepha noma izici ezingase zisetshenziswe ku-Renesas Electronics hardware noma imikhiqizo yesofthiwe, i-Renesas Electronics ngeke ibe nacala ngenxa yanoma yikuphi ubungozi noma ukwephulwa kwezokuphepha, okuhlanganisa kodwa okungakhawulelwe kunoma yikuphi ukufinyelela okungagunyaziwe noma ukusetshenziswa komkhiqizo we-Renesas Electronics. noma isistimu esebenzisa umkhiqizo we-Renesas Electronics. I-RENESAS ELECTRONICS AYIKUNIKEZI IZIQINISEKISO NOMA IQINISEKISI UKUTHI IQINISEKISA IMIKHIQIZO KA-ELECTRONICS, NOMA IZINHLELO EZIDALWA KUSETYENZISWA IMIKHIQIZO YE-RENESAS ELECTRONICS NGEKE IBE ENGABANDAKANYEZEKI NOMA MAHHALA EKONAKELENI, EKUHLASELWENI, EMGWENI, EKUPHATHELENI, UKUNGENZEKA OKUNYE” ). I-RENESAS ELECTRONICS IKUXOXA NOMA YILUPHI NASO SONKE ISIBOPHO NOMA ISIBOPHO ESIVELA NOMA ESIHLOBANE NOMA YIZIPHI IZINDABA ZOKUNGCAKAZI. NGAPHEZU kwalokho, NGEZINGA LOKUVUNYWA UMTHETHO OSEBENZAYO, I-RENESAS ELECTRONICS IZINKUVUMA NOMA YILUPHI KANYE NAZO ZONKE IZIQINISEKISO, EZIPHUMILEYO NOMA OKUSHIWO, NGENHLONIPHO YALO MBHALO KANYE NOMA YIYIPHI ISOFTHIWERE EHLOBANE NOMA EHAMBISANA NAYO, AYINGANI NOKUBHELWA, AKUFANELEKILE NGENXA YESIVIVINYO. INJONGO ETHILE.
  8. Lapho usebenzisa imikhiqizo ye-Renesas Electronics, bheka ulwazi lwakamuva lomkhiqizo (amaphepha edatha, amamanyuwali omsebenzisi, amanothi ohlelo, “Amanothi Avamile Okuphatha nokusebenzisa Amadivayisi Asebenzisa Ugesi” kubhukwana lokuthembeka, njll.), futhi uqinisekise ukuthi izimo zokusebenzisa zingaphakathi kwebanga. ecaciswe yi-Renesas Electronics mayelana nezilinganiso eziphezulu, ukunikezwa kwamandla okusebenzayo voltagububanzi, izici zokukhipha ukushisa, ukufakwa, njll. I-Renesas Electronics ilahla noma isiphi isikweletu sanoma yikuphi ukungasebenzi kahle, ukwehluleka noma ingozi ebangelwa ukusetshenziswa kwemikhiqizo ye-Renesas Electronics ngaphandle kobubanzi obunjalo.
  9. Nakuba i-Renesas Electronics izama ukuthuthukisa ikhwalithi nokuthembeka kwemikhiqizo ye-Renesas Electronics, imikhiqizo ye-semiconductor inezici ezithile, njengokuvela kokwehluleka ngezinga elithile kanye nokungasebenzi kahle ngaphansi kwezimo ezithile zokusetshenziswa. Ngaphandle uma kuqokwe njengomkhiqizo onokwethenjelwa kakhulu noma umkhiqizo wezindawo ezinokhahlo eshidini ledatha le-Renesas Electronics noma omunye umbhalo we-Renesas Electronics, imikhiqizo ye-Renesas Electronics ayikho ngaphansi kwesakhiwo sokumelana nemisebe. Unomthwalo wemfanelo wokusebenzisa izinyathelo zokuphepha ukuze uvikele ubungozi bokulimala komzimba, ukulimala noma ukulimala okubangelwa umlilo, kanye/noma ingozi emphakathini uma kwenzeka ukwehluleka noma ukungasebenzi kahle kwemikhiqizo ye-Renesas Electronics, efana nedizayini yokuphepha yezingxenyekazi zekhompyutha kanye isofthiwe, okuhlanganisa kodwa kungagcini ngokuphelelwa amandla, ukulawula umlilo kanye nokuvimbela ukungasebenzi kahle, ukwelashwa okufanele kokuncipha kokuguga nanoma yiziphi ezinye izinyathelo ezifanele. Ngenxa yokuthi ukuhlolwa kwesofthiwe ye-microcomputer kukodwa kunzima kakhulu futhi akusebenzi, unesibopho sokuhlola ukuphepha kwemikhiqizo yokugcina noma amasistimu akhiwe nguwe.
  10. Sicela uthinte ihhovisi lezokuthengisa le-Renesas Electronics ukuze uthole imininingwane ngezindaba zemvelo ezifana nokuhambisana kwemvelo komkhiqizo ngamunye we-Renesas Electronics. Unesibopho sokuphenya ngokucophelela nangokwanele imithetho esebenzayo neziqondiso ezilawula ukufakwa noma ukusetshenziswa kwezinto ezilawulwayo, okuhlanganisa ngaphandle komkhawulo, i-EU RoHS Directive, nokusebenzisa imikhiqizo ye-Renesas Electronics ngokuthobela yonke le mithetho nezimiso ezisebenzayo. I-Renesas Electronics ilahla noma isiphi isikweletu somonakalo noma ukulahlekelwa okwenzeka ngenxa yokungathobeli kwakho imithetho nezimiso ezisebenzayo.
  11. Imikhiqizo nobuchwepheshe be-Renesas Electronics ngeke kusetshenziselwe noma kufakwe kunoma yimiphi imikhiqizo noma amasistimu ukukhiqizwa, ukusetshenziswa, noma ukuthengiswa kwayo kunqatshelwe ngaphansi kwanoma yimiphi imithetho noma iziqondiso ezisebenzayo zasekhaya noma zangaphandle. Uzothobelana nanoma yimiphi imithetho esebenzayo yokulawula ukuthekelisa emenyezelwe futhi elawulwa ohulumeni banoma imaphi amazwe afakazela amandla phezu kwezinhlangano noma okwenziwayo.
  12. Kuyisibopho somthengi noma umsabalalisi wemikhiqizo ye-Renesas Electronics, nanoma iyiphi enye inhlangano esabalalisa, elahla, noma ethengisa noma edlulisela umkhiqizo komunye umuntu wesithathu, ukwazisa lowo muntu wesithathu kusengaphambili ngokuqukethwe nemibandela ebekiwe. kulo mbhalo.
  13. Lo mbhalo ngeke uphrintwe kabusha, ukhiqizwe kabusha noma uphindwe nganoma yiluphi uhlobo, uphelele noma ingxenye, ngaphandle kwemvume ebhaliwe yangaphambili ye-Renesas Electronics.
  14. Sicela uthinte ihhovisi lezokuthengisa le-Renesas Electronics uma unemibuzo mayelana nolwazi oluqukethwe kulo mbhalo noma imikhiqizo ye-Renesas Electronics.

(Qaphela1) “I-Renesas Electronics” njengoba isetshenziswe kulo mbhalo isho i-Renesas Electronics Corporation futhi ihlanganisa nezinkampani ezingaphansi kwayo ezilawulwa ngokuqondile noma ngokungaqondile.
(Qaphela2) “I(i)mikhiqizo ye-Renesas Electronics” ichaza noma yimuphi umkhiqizo owenziwe noma okhiqizwe yi-Renesas Electronics.

Indlunkulu Yenkampani
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com

Ulwazi lokuxhumana
Ukuze uthole ulwazi olwengeziwe ngomkhiqizo, ubuchwepheshe, inguqulo yakamuva yedokhumenti, noma ihhovisi lezokuthengisa eliseduze nawe, sicela uvakashele:
www.renesas.com/contact/

Izimpawu zokuhweba
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© 2021 Renesas Electronics Corporation. Wonke Amalungelo Agodliwe.

Amadokhumenti / Izinsiza

Umndeni wakwa-RENESAS RA, umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers [pdf] Incwadi Yomnikazi
R01AN7402EJ0100, umndeni wakwa-RA umndeni wakwa-RX 32-Bit Arm Cortex-M Microcontrollers, umndeni wakwa-RA umndeni we-RX, 32-Bit Arm Cortex-M Microcontrollers, Arm Cortex-M Microcontrollers, Cortex-M Microcontrollers, Microcontrollers

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