I-intel AN 769 FPGA I-Remote Temperature Sensing Diode
Isingeniso
Ezinhlelweni zesimanje ze-elekthronikhi, ikakhulukazi izinhlelo zokusebenza ezidinga ukulawulwa kwezinga lokushisa okubalulekile, ukukalwa kwezinga lokushisa kwe-chip kubalulekile.
Amasistimu okusebenza okuphezulu ancike ezilinganisweni zokushisa ezinembile zendawo yasendlini nengaphandle.
- Lungiselela ukusebenza
- Qinisekisa ukusebenza okuthembekile
- Vimbela ukulimala kwezingxenye
Isistimu yokuqapha izinga lokushisa ye-Intel® FPGA ikuvumela ukuthi usebenzise ama-chips ezinkampani zangaphandle ukuze ugade izinga lokushisa le-junction (TJ). Lolu hlelo lwangaphandle lokuqapha izinga lokushisa lusebenza noma i-Intel FPGA inikwe amandla noma ingalungiselelwe. Kodwa-ke, kunezinto ezimbalwa okufanele uzicabangele lapho uklama ukuxhumana phakathi kwe-chip yangaphandle ne-Intel FPGA ekwazi ukuzwa izinga lokushisa elikude (TSDs).
Uma ukhetha i-chip ezwa izinga lokushisa, ngokuvamile uzobheka ukunemba kwezinga lokushisa ofuna ukukuzuza. Kodwa-ke, ngobuchwepheshe benqubo bakamuva kanye nedizayini ehlukile ye-TSD ekude, kufanele futhi ucabangele izici ezakhelwe ngaphakathi ze-chip yenzwa yokushisa ukuze uhlangabezane nezimfuneko zokunemba komklamo wakho.
Ngokuqonda ukusebenza kohlelo lwe-Intel FPGA lokulinganisa izinga lokushisa elikude, ungakwazi:
- Zitholele izinkinga ezijwayelekile ngezinhlelo zokusebenza zokuzwa izinga lokushisa.
- Khetha i-chip ezwa izinga lokushisa efaneleke kakhulu ehlangabezana nezidingo zakho zohlelo lokusebenza, izindleko, nesikhathi sokuklama.
I-Intel incoma kakhulu ukuthi ulinganise izinga lokushisa lokufa usebenzisa ama-TSD endawo, i-Intel ewaqinisekisile. I-Intel ayikwazi ukuqinisekisa ukunemba kwezinzwa zokushisa zangaphandle ngaphansi kwezimo ezihlukahlukene zesistimu. Uma ufuna ukusebenzisa ama-TSD akude nezinzwa zangaphandle, landela imihlahlandlela kule dokhumenti futhi uqinisekise ukunemba kokusetha isikali sakho sokushisa.
Leli nothi lohlelo lokusebenza lisebenza ekusetshenzisweni okukude kwe-TSD yomndeni wedivayisi ye-Intel Stratix® 10 FPGA.
Ukuqaliswa Kuphelileview
I-chip yangaphandle yokuzwa izinga lokushisa ixhuma ku-Intel FPGA ekude ye-TSD. I-TSD ekude iyi-PNP noma i-NPN diode-connected transistor.
- Umfanekiso 1. Ukuxhumana Phakathi Kwe-Temperature Sensing Chip ne-Intel FPGA Remote TSD (NPN Diode)
- Umfanekiso 2. Ukuxhumana Phakathi Kwe-Temperature Sensing Chip ne-Intel FPGA Remote TSD (PNP Diode)
Isibalo esilandelayo sakha izinga lokushisa le-transistor ngokuhlobene ne-base-emitter voltage (VBE).
- Isibalo 1. Ubudlelwano Phakathi Kwezinga Lokushisa Le-Transistor kuya ku-Base-Emitter Voltage (VBE)
Kuphi:
- T—Izinga lokushisa ku-Kelvin
- q—i-electron charge (1.60 × 10−19 C)
- I-VBE-base-emitter voltage
- k—Boltzmann njalo (1.38 × 10−23 J∙K−1)
- IC - umqoqi wamanje
- IS—i-reverse saturation current
- η—isici sokuhle se-diode ekude
Ukuhlela kabusha Izibalo 1, uthola isibalo esilandelayo.
- Isibalo 2. VBE
Imvamisa, i-chip ezwa izinga lokushisa iphoqa amazanyana amabili alandelanayo alawulwa kahle, i-I1 ne-I2 kumaphini we-P kanye no-N. I-chip ibe isikala futhi ilinganise ukushintsha kwe-VBE ye-diode. I-delta ku-VBE ilingana ngokuqondile nezinga lokushisa, njengoba kuboniswe ku-Equation 3. - Isibalo 3. Delta ku-VBE
Kuphi:
- n-isilinganiso samanje esiphoqelelwe
- I-VBE1-base-emitter voltage i1
- I-VBE2-base-emitter voltage i2
Ukucatshangelwa kokuqaliswa
Ukukhetha i-chip ezwa izinga lokushisa enezici ezifanele kukuvumela ukuthi ulungiselele i-chip ukuze ufinyelele ukunemba kokulinganisa. Cabangela izihloko kulwazi oluhlobene lapho ukhetha i-chip.
- I-Ideality Factor (η-Factor) Mismatch
- Iphutha Lokumelana Nochungechunge
- I-Temperature Diode Beta Ukuhluka
- I-Differential Inputor Capacitor
- Isinxephezelo se-Offset
I-Ideality Factor (η-Factor) Mismatch
Uma wenza isilinganiso sokushisa kwe-junction ngokusebenzisa i-diode yangaphandle lokushisa, ukunemba kwesilinganiso sokushisa kuncike ezicini ze-diode yangaphandle. I-ideality factor ipharamitha ye-diode ekude ekala ukuchezuka kwe-diode ekuziphatheni kwayo okuhle.
Ngokuvamile ungathola isici esihle eshidini ledatha kumkhiqizi we-diode. Ama-diode okushisa angaphandle ahlukene akunikeza amanani ahlukene ngenxa yedizayini ehlukene kanye nobuchwepheshe benqubo ababusebenzisayo.
Ukungafani kokufanelekile kungabangela iphutha elibalulekile lokulinganisa izinga lokushisa. Ukuze ugweme iphutha elibalulekile, i-Intel incoma ukuthi ukhethe i-chip ezwa izinga lokushisa enezici ezinhle ezilungisekayo. Ungashintsha inani lesici sokuhle ku-chip ukuze ususe iphutha lokungafani.
- Example 1. I-Ideality Factor Contribution Ephutheni Lokulinganisa Izinga lokushisa
Lesi exampi-le ibonisa ukuthi i-ideality factor inikela kanjani ephutheni lokulinganisa izinga lokushisa. Ku-exampLe, isibalo sibonisa ukungafani kokuhle okubangela iphutha elibalulekile lokulinganisa izinga lokushisa.
- Isibalo 4. I-Ideality Factor Ubudlelwano Nezinga Lokushisa Elilinganiselwe
Kuphi:
- I-ηTSC—isici esifanelekile se-chip ezwa izinga lokushisa
- I-TTSC—izinga lokushisa elifundwa yi-chip ezwa izinga lokushisa
- I-ηRTD—isici esifanelekile se-diode yezinga lokushisa elikude
- I-TRTD—izinga lokushisa ku-diode yokushisa ekude
Izinyathelo ezilandelayo zokulinganisa izinga lokushisa (TTSC) nge-chip ezwa izinga lokushisa, uma kunikezwe amanani alandelayo:
- I-Ideality factor yenzwa yezinga lokushisa (ηTSC) ingu-1.005
- I-Ideality factor ye-remote temperature diode (ηRTD) ingu-1.03
- Izinga lokushisa langempela ku-diode yokushisa okukude (TRTD) ngu-80°C
- Guqula i-TRTD ka-80°C ibe i-Kelvin: 80 + 273.15 = 353.15 K.
- Sebenzisa i-Equation 4. Izinga lokushisa elibalwe yi-chip ezwa izinga lokushisa ngu-1.005 × 353.15 = 344.57 K.TTSC = 1.03
- Guqula inani elibaliwe libe yi-Celsius: TTSC = 344.57 K – 273.15 K = 71.43°C Iphutha lokushisa (TE) elidalwe ukungafani kokuhle:
TE = 71.43°C – 80.0°C = –8.57°C
Iphutha Lokumelana Nochungechunge
Ukumelana nochungechunge kumaphini we-P no-N kunomthelela ephutheni lokulinganisa izinga lokushisa.
Ukumelana kochungechunge kungavela:
- Ukumelana kwangaphakathi kwephinikhodi ye-P ne-N ye-diode yokushisa.
- Ibhodi ilandela ukumelana, ngokwesiboneloample, umkhondo webhodi elide.
Ukumelana kochungechunge kubangela ivolumu eyengeziwetage ukwehla endleleni yokuzwa izinga lokushisa futhi kubangele iphutha lesilinganiso, kuthinte ukunemba kwesilinganiso sokushisa. Ngokuvamile, lesi simo senzeka uma wenza isilinganiso sezinga lokushisa nge-chip yokuzwa izinga lokushisa lamanje elingu-2.
Umfanekiso 3. Ukumelana Nochungechunge Lwangaphakathi Nolwebhodi
Ukuze uchaze iphutha lezinga lokushisa elenzeka lapho ukumelana nochungechunge kukhula, omunye umenzi we-chip wenzwa yokushisa unikeza idatha yephutha le-diode yerimothi lokushisa ngokumelene nokumelana.
Kodwa-ke, ungasusa iphutha lokumelana nochungechunge. Enye i-chip ezwa izinga lokushisa inesici esakhelwe ngaphakathi sokukhansela ukumelana nochungechunge. Isici sokukhansela ukuphikiswa kochungechunge singaqeda ukumelana nochungechunge ukusuka kububanzi bamakhulu ambalwa Ω ukuya kububanzi obudlula izinkulungwane ezimbalwa Ω.
I-Intel incoma ukuthi ucabangele isici sokukhansela ukuphikiswa kochungechunge uma ukhetha i-chip ezwa izinga lokushisa. Isici sisusa ngokuzenzakalelayo iphutha lezinga lokushisa elibangelwa ukumelana komzila ku-transistor ekude.
I-Temperature Diode Beta Ukuhluka
Njengoba inqubo yejometri yobuchwepheshe iba mancane, inani le-Beta(β) le-PNP noma i-NPN substrate liyehla.
Njengoba inani le-Beta yezinga lokushisa liyancipha, ikakhulukazi uma isiqoqi se-diode yezinga lokushisa siboshelwe phansi, inani le-Beta lithinta isilinganiso samanje ku-Equation 3 ekhasini 5. Ngakho-ke, ukulondoloza isilinganiso esinembile samanje kubalulekile.
Amanye ama-chips ezwa izinga lokushisa anesici esakhelwe ngaphakathi sesinxephezelo se-Beta. Ukuhluka kwe-Beta kokujikeleza kuzwa isisekelo samanje futhi kulungisa i-emitter yamanje ukuze kunxeshezelwe ukuhluka. Isinxephezelo se-Beta sigcina isilinganiso samanje somqoqi.
Umfanekiso 4. I-Intel Stratix 10 Core Fabric Temperature Diode ene-Maxim Integrated*'s MAX31730 Beta Compensation Inikwe amandla
Lesi sibalo sibonisa ukuthi ukunemba kokulinganisa kufinyelelwa ngesinxephezelo se-Beta esinikwe amandla. Izilinganiso zithathwe ngesikhathi sokwehla kwamandla e-FPGA—isethi namazinga okushisa alinganisiwe kulindeleke ukuthi asondele.
| 0˚C | 50˚C | 100˚C | |
| Isinxephezelo Se-Beta Sivaliwe | 25.0625˚C | 70.1875˚C | 116.5625˚C |
| Isinxephezelo Se-Beta Sivuliwe | -0.6875˚C | 49.4375˚C | 101.875˚C |
I-Differential Inputor Capacitor
I-capacitor (CF) kumaphini we-P kanye no-N isebenza njengesihlungi se-low-pass esiza ukuhlunga umsindo wefrikhwensi ephezulu futhi sithuthukise ukuphazamiseka kwe-electromagnetic (EMI).
Kufanele uqaphele ngesikhathi sokukhetha i-capacitor ngoba amandla amakhulu angathinta isikhathi sokukhuphuka komthombo wamanje oshintshiwe futhi wethule iphutha elikhulu lokulinganisa. Ngokuvamile, umkhiqizi we-chip ezwa izinga lokushisa unikeza inani elinconyiwe le-capacitance kushidi lakhe ledatha. Bheka imihlahlandlela yokuklama yomkhiqizi we-capacitor noma isincomo ngaphambi kokuthi unqume inani le-capacitance.
Umfanekiso 5. Amandla Okufaka Okuhlukile
Isinxephezelo se-Offset
Izinto eziningi zinganikela ngesikhathi esisodwa ephutheni lokulinganisa. Kwesinye isikhathi, ukusebenzisa indlela eyodwa yesinxephezelo kungase kungayixazululi ngokugcwele inkinga. Enye indlela yokuxazulula iphutha lokulinganisa ukusebenzisa isinxephezelo se-offset.
Qaphela: I-Intel incoma ukuthi usebenzise i-chip ezwa izinga lokushisa enesinxephezelo esakhelwe ngaphakathi se-offset. Uma i-chip ezwa izinga lokushisa ingasisekeli isici, ungasebenzisa isinxephezelo se-offset phakathi nokucubungula okuthunyelwe ngokusebenzisa ingqondo yangokwezifiso noma isofthiwe.
Isinxephezelo se-offset sishintsha inani lerejista ye-offset kusuka ku-chip ezwa izinga lokushisa ukuze kuqedwe iphutha elibaliwe. Ukuze usebenzise lesi sici, kufanele wenze i-temperature profile funda futhi uhlonze inani le-offset ongalisebenzisa.
Kufanele uqoqe izilinganiso zezinga lokushisa phakathi kwebanga lokushisa olifunayo ngezilungiselelo ezizenzakalelayo ze-chip ezwa izinga lokushisa. Ngemva kwalokho, yenza ukuhlaziya idatha njengakusibonelo esilandelayoample yokunquma inani le-offset elizosetshenziswa. I-Intel incoma ukuthi uhlole ama-chips ezwa izinga lokushisa ambalwa nge-diode ekude yokushisa ukuze uqinisekise ukuthi uhlanganisa ukuhluka kwengxenye nengxenye. Bese, sebenzisa isilinganiso sokulinganisa ekuhlaziyeni ukuze unqume izilungiselelo ozozisebenzisa.
Ungakhetha amaphoyinti okushisa ozowahlola ngokusekelwe esimweni sokusebenza kwesistimu yakho.
I-Equation 5. I-Offset Factor
Exampngo-2. Ukusetshenziswa Kwesinxephezelo Se-OffsetKulokhu example, isethi yezilinganiso zokushisa yaqoqwa ngamaphoyinti amathathu okushisa. Sebenzisa i-Equation 5 kumanani bese ubala isici sokususa.
Ithebula 1. Idatha Eqoqwe Ngaphambi Kokufaka Isicelo Sesinxephezelo Se-Offset
| Setha izinga lokushisa | Izinga Lokushisa Elilinganiselwe | ||
| 100°C | 373.15 K | 111.06°C | 384.21 K |
| 50°C | 323.15 K | 61.38°C | 334.53 K |
| 0°C | 273.15 K | 11.31°C | 284.46 K |
Sebenzisa iphoyinti eliphakathi lebanga lokushisa ukuze ubale izinga lokushisa elilinganiselwe. Kulesi exampi-le, indawo emaphakathi izinga lokushisa elibekiwe elingu-50°C.
Izinga lokushisa elilinganiselwe
- = Isici se-offset × ( izinga lokushisa elilinganisiwe−Setha izinga lokushisa)
- = 0.9975 × (334.53 − 323.15)
- = 11.35
Faka inani lokushisa elilinganiselwe nezinye izici zesinxephezelo, uma kudingekile, ku-chip ezwa izinga lokushisa bese uphinde uthathe isilinganiso.
Ithebula 2. Idatha Eqoqwe Ngemva Kokusebenzisa Isinxephezelo Se-Offset
| Setha izinga lokushisa | Izinga Lokushisa Elilinganiselwe | Iphutha |
| 100°C | 101.06°C | 1.06°C |
| 50°C | 50.13°C | 0.13°C |
| 0°C | 0.25°C | 0.25°C |
Ulwazi Oluhlobene
Imiphumela Yokuhlola
Inikeza kabushaview yemiphumela yokuhlolwa yendlela yesinxephezelo se-offset nge-Maxim Integrated* kanye ne-Texas Instruments* ama-chips ezwa izinga lokushisa.
Imiphumela Yokuhlola
Ekuhlolweni, amakhithi okuhlola we-Maxim Integrated*'s MAX31730 kanye ne-Texas Instruments*'s TMP468 ashintshiwe ukuze ahlangane nezinga lokushisa elikude lamabhulokhi ambalwa ku-Intel FPGA.
Ithebula 3. Amabhulokhi Ahloliwe kanye namamodeli weBhodi
| Vimba | Ibhodi Lokuhlola I-Chip Yezinzwa Zezinga lokushisa | |
| Texas Instruments 'TMP468 | I-Maxim Integrate d's MAX31730 | |
| Intel Stratix 10 core Indwangu | Yebo | Yebo |
| I-H-tile noma i-L-tile | Yebo | Yebo |
| I-E-tile | Yebo | Yebo |
| I-P-tile | Yebo | Yebo |
Izibalo ezilandelayo zibonisa ukusethwa kwebhodi le-Intel FPGA elinamabhodi okuhlola i-Maxim Integrated kanye ne-Texas Instruments.
Umfanekiso 6. Setha nge-Maxim Integrate d's MAX31730 Ibhodi Lokuhlola
Umfanekiso 7. Setha nge-Texas Instruments' TMP468 Evaluation Board
- I-thermal force-noma okunye, ungasebenzisa igumbi lokushisa-elimbozwe futhi lavala i-FPGA futhi waphoqelela izinga lokushisa njengephuzu lokushisa elimisiwe.
- Phakathi nalokhu kuhlolwa, i-FPGA yahlala isesimweni esingenawo amandla ukuyigwema ekukhiqizeni ukushisa.
- Isikhathi sokucwiliswa kwephuzu ngalinye lokuhlola izinga lokushisa kwakuyimizuzu engama-30.
- Izilungiselelo ezikumakhithi okuhlola zisebenzise izilungiselelo ezizenzakalelayo ezivela kubakhiqizi.
- Ngemva kokusetha, izinyathelo Zesinxephezelo Se-offset ekhasini le-10 zalandelwa ukuze kuqoqwe futhi kuhlaziywe idatha.
Ukuhlola ngebhodi Lokuhlola I-chip ye-Maxim Integrated's MAX31730 Temperature Sensing Chip
Lokhu kuhlola kwenziwe ngezinyathelo zokusetha njengoba kuchazwe ku-Offset Compensation.
Idatha yaqoqwa ngaphambi nangemuva kokusebenzisa isinxephezelo se-offset. Izinga lokushisa elihlukile le-offset lisetshenziswe kumabhulokhi e-Intel FPGA ahlukene ngoba inani elilodwa le-offset alikwazi ukusetshenziswa kuwo wonke amabhulokhi. Izibalo ezilandelayo zibonisa imiphumela.
Umfanekiso 8. Idatha ye-Intel Stratix 10 Core Fabric
Umfanekiso 9. Idatha ye-Intel FPGA H-Tile ne-L-Tile
Umfanekiso 10. Idatha ye-Intel FPGA E-Tile
Umfanekiso 11. Idatha ye-Intel FPGA P-Tile
Ukuhlola nge-Texas Instruments's TMP468 Temperature Sensing Chip Evaluation Board
Lokhu kuhlola kwenziwe ngezinyathelo zokusetha njengoba kuchazwe ku-Offset Compensation.
Idatha yaqoqwa ngaphambi nangemuva kokusebenzisa isinxephezelo se-offset. Izinga lokushisa elihlukile le-offset lisetshenziswe kumabhulokhi e-Intel FPGA ahlukene ngoba inani elilodwa le-offset alikwazi ukusetshenziswa kuwo wonke amabhulokhi. Izibalo ezilandelayo zibonisa imiphumela.
Umfanekiso 12. Idatha ye-Intel Stratix 10 Core Fabric
Umfanekiso 13. Idatha ye-Intel FPGA H-Tile ne-L-Tile
Umfanekiso 14. Idatha ye-Intel FPGA E-Tile
Umfanekiso 15. Idatha ye-Intel FPGA P-Tile
Isiphetho
Baningi abakhiqizi be-chip bezwa lokushisa abahlukene. Ngesikhathi sokukhetha ingxenye, i-Intel incoma ngokuqinile ukuthi ukhethe i-chip ezwa izinga lokushisa ngokunaka okulandelayo.
- Khetha i-chip enesici esilungisekayo sesici sokuhle.
- Khetha i-chip enochungechunge lokukhansela ukumelana.
- Khetha i-chip esekela isinxephezelo se-Beta.
- Khetha ama-capacitor afana nezincomo zomkhiqizi we-chip.
- Faka noma yisiphi isinxephezelo esifanele ngemva kokwenza i-temperature profile funda.
Ngokusekelwe ekusetshenzisweni kokucatshangelwa kanye nemiphumela yokuhlola, kufanele ulungiselele i-chip yenzwa yokushisa kumklamo wakho ukuze uzuze ukunemba kokulinganisa.
Umlando Wokubuyekezwa Kombhalo we-AN 769: I-Intel FPGA Remote Temperature Sensing Diode Umhlahlandlela
| Inguqulo Yedokhumenti | Izinguquko |
| 2022.04.06 |
|
| 2021.02.09 | Ukukhishwa kokuqala. |
Inkampani ye-Intel Wonke Amalungelo Agodliwe. I-Intel, ilogo ye-Intel, nezinye izimpawu ze-Intel yizimpawu zokuthengisa ze-Intel Corporation noma izinkampani ezingaphansi kwayo. I-Intel iqinisekisa ukusebenza kwe-FPGA yayo kanye nemikhiqizo ye-semiconductor ekucacisweni kwamanje ngokuvumelana newaranti evamile ye-Intel, kodwa igodla ilungelo lokwenza izinguquko kunoma imiphi imikhiqizo namasevisi nganoma yisiphi isikhathi ngaphandle kwesaziso. I-Intel ayithathi mthwalo noma isikweletu esivele ngenxa yesicelo noma ukusetshenziswa kwanoma yiluphi ulwazi, umkhiqizo, noma isevisi echazwe lapha ngaphandle kwalapho okuvunyelwene ngakho ngokubhaliwe yi-Intel. Amakhasimende e-Intel ayelulekwa ukuthi athole inguqulo yakamuva yokucaciswa kwedivayisi ngaphambi kokuthembela kunoma yiluphi ulwazi olushicilelwe nangaphambi kokufaka ama-oda emikhiqizo noma amasevisi.
*Amanye amagama namabhrendi angafunwa njengempahla yabanye.
ISO
9001:2015
Ibhalisiwe
Amadokhumenti / Izinsiza
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I-intel AN 769 FPGA I-Remote Temperature Sensing Diode [pdf] Umhlahlandlela Womsebenzisi I-AN 769 FPGA I-Remote Temperature Sensing Diode, AN 769, FPGA I-Remote Temperature Diode, I-Remote Temperature Diode, I-Diode Ezwa Izinga lokushisa, i-Diode Ezwayo |
